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| 2.0x1.25mm SMD CHIP LED LAMP APTC2012MBC BLUE Features !2.0mmx1.25mm SMT LED,0.75mm THICKNESS. !LOW Description The Blue source color devices are made with GaN on SiC Light Emitting Diode. Static electricity and surge damage the LEDS. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded. POWER CONSUMPTION. VIEWING ANGLE. COLORS AND LENS TYPES AVAILABLE. : 2000PCS / REEL. !WIDE !IDEAL FOR BACKLIGHT AND INDICATOR. !VARIOUS !PACKAGE Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD0961 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/22/2003 DRAWN: S.J.HOU PAGE: 1 OF 4 Selection Guide Par t No . Dic e L en s Ty p e Iv (m c d ) @ 20 m A Min . APTC2012MBC BLUE (GaN) WATER CLEAR 4 Ty p . 10 V i ew i n g An g l e 21/2 120 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25C Sy m b o l peak D 1/2 C VF IR Par am et er Peak Wavelength Dominate Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current Blue Blue Blue Blue Blue Blue D ev i c e Ty p . 430 466 60 100 3.8 4.5 10 Max . Un it s nm nm nm pF V uA Tes t Co n d it io n s IF = 2 0 m A IF = 2 0 m A IF = 2 0 m A V F = 0 V; f = 1 M Hz IF = 2 0 m A VR = 5V Absolute Maximum Ratings at T)=25C P ar am e t e r Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating / Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. B lu e 105 30 150 5 -40C To +85C Un it s mW mA mA V SPEC NO: DSAD0961 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/22/2003 DRAWN: S.J.HOU PAGE: 2 OF 4 Blue APTC2012MBC SPEC NO: DSAD0961 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/22/2003 DRAWN: S.J.HOU PAGE: 3 OF 4 APTC2012MBC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD0961 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/22/2003 DRAWN: S.J.HOU PAGE: 4 OF 4 |
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